Publication:

SEMI-PointRend: Improved Semiconductor Wafer Defect Classification and Segmentation as Rendering

Date

2023
Proceedings Paper
https://doi.org/10.1117/12.2657555
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dc.contributor.authorHwang, MinJin
dc.contributor.authorDey, Bappaditya
dc.contributor.authorDehaerne, Enrique
dc.contributor.authorHalder, Sandip
dc.contributor.authorShin, Young-Han
dc.contributor.imecauthorHwang, MinJin
dc.contributor.imecauthorDey, Bappaditya
dc.contributor.imecauthorDehaerne, Enrique
dc.contributor.imecauthorHalder, Sandip
dc.contributor.orcidimecDey, Bappaditya::0000-0002-0886-137X
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimecDehaerne, Enrique::0000-0001-9021-2469
dc.date.accessioned2024-03-07T15:16:17Z
dc.date.available2023-07-28T17:39:47Z
dc.date.available2023-07-31T13:15:41Z
dc.date.available2024-03-07T15:16:17Z
dc.date.issued2023
dc.description.wosFundingTextThis research was supported by the MOTIE (Ministry of Trade, Industry, and Energy) in Korea, under the Fostering Global Talents for Innovative Growth Program (P0017312) supervised by the Korea Institute for Advancement of Technology (KIAT).
dc.identifier.doi10.1117/12.2657555
dc.identifier.eisbn978-1-5106-6100-4
dc.identifier.isbn978-1-5106-6099-1
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42230
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING
dc.source.beginpageArt. 1249608
dc.source.conferenceConference on Metrology, Inspection, and Process Control XXXVII
dc.source.conferencedateFEB 27-MAR 02, 2023
dc.source.conferencelocationSan Jose
dc.source.journalProceedings of SPIE
dc.source.numberofpages7
dc.source.volume12496
dc.title

SEMI-PointRend: Improved Semiconductor Wafer Defect Classification and Segmentation as Rendering

dc.typeProceedings paper
dspace.entity.typePublication
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