Publication:
Lessons learned from 3D DRAM-on-logic chip development
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-20T10:05:53Z | |
| dc.date.available | 2021-10-20T10:05:53Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2012-02 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/20359 | |
| dc.identifier.url | http://www.semiconductorpackagingnews.com/articles/article_34910.shtml | |
| dc.source.journal | Semiconductor Packaging News | |
| dc.title | Lessons learned from 3D DRAM-on-logic chip development | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | Original bundle
| |
| Publication available in collections: |