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Microbumping technology for hybrid IR detectors, 10 $lm pitch and beyond

Date

2014
Proceedings Paper
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dc.contributor.authorMajeed, Bivragh
dc.contributor.authorSoussan, Philippe
dc.contributor.authorLe Boterf, P.
dc.contributor.authorBouillon, P.
dc.contributor.imecauthorMajeed, Bivragh
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.date.accessioned2021-10-22T03:22:47Z
dc.date.available2021-10-22T03:22:47Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24185
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7028336
dc.source.beginpage453
dc.source.conferenceIEEE 16th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate3/12/2014
dc.source.conferencelocationSingapore Singapore
dc.source.endpage457
dc.title

Microbumping technology for hybrid IR detectors, 10 $lm pitch and beyond

dc.typeProceedings paper
dspace.entity.typePublication
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