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Backside thinned CMOS imagers with high broadband quantum efficiency realised using a new integration process

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dc.contributor.authorDe Munck, Koen
dc.contributor.authorBogaerts, Jan
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorDe Moor, Piet
dc.contributor.authorSedky, Sherif
dc.contributor.authorVan Hoof, Chris
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.date.accessioned2021-10-17T06:46:10Z
dc.date.available2021-10-17T06:46:10Z
dc.date.issued2008
dc.identifier.issn0013-5194
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13614
dc.source.beginpage50
dc.source.endpage51
dc.source.issue1
dc.source.journalElectronics Letters
dc.source.volume44
dc.title

Backside thinned CMOS imagers with high broadband quantum efficiency realised using a new integration process

dc.typeJournal article
dspace.entity.typePublication
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