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The effect of Ar/H2 plasma pretreatments on porous k=2.0 dielectrics for pore sealing by self-assembled monolayers deposition

Date

2013
Proceedings Paper
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dc.contributor.authorSun, Yiting
dc.contributor.authorSwerts, Johan
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorMaheshwari, Abhishek
dc.contributor.authorPrado, J.L.
dc.contributor.authorDe Feyter, Steven
dc.contributor.authorArmini, Silvia
dc.contributor.imecauthorSun, Yiting
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.date.accessioned2021-10-21T12:29:48Z
dc.date.available2021-10-21T12:29:48Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23139
dc.identifier.urlhttp://www.scientific.net/SSP.195.146
dc.source.beginpage146
dc.source.conferenceUltra Clean Processing of Semiconductor Surfaces XI - UCPSS
dc.source.conferencedate17/09/2012
dc.source.conferencelocationGent Belgium
dc.source.endpage149
dc.title

The effect of Ar/H2 plasma pretreatments on porous k=2.0 dielectrics for pore sealing by self-assembled monolayers deposition

dc.typeProceedings paper
dspace.entity.typePublication
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