Publication:
Resistance to electromigration of purely intermetallic micro-bump interconnections for 3D-device stacking
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1864 since deposited on 2021-10-17
3last month
Acq. date: 2025-12-16
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Metrics
Views
1864 since deposited on 2021-10-17
3last month
Acq. date: 2025-12-16
Citations