Publication:
Reliability challenges related to TSV integration and 3D stacking
Date
| dc.contributor.author | Croes, Kristof | |
| dc.contributor.imecauthor | Croes, Kristof | |
| dc.contributor.orcidimec | Croes, Kristof::0000-0002-3955-0638 | |
| dc.date.accessioned | 2021-10-19T12:58:25Z | |
| dc.date.available | 2021-10-19T12:58:25Z | |
| dc.date.issued | 2011 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18749 | |
| dc.source.conference | IEEE International Reliability Physics Symposium - IRPS | |
| dc.source.conferencedate | 10/04/2011 | |
| dc.source.conferencelocation | Monterey CA, USA | |
| dc.title | Reliability challenges related to TSV integration and 3D stacking | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
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