Publication:

Modeling-Based Improvement of Microscale Liquid Jet Impingement Cooling

Date

2024
Journal article
https://doi.org/10.1109/TCPMT.2024.3421585
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dc.contributor.authorElsinger, Georg
dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVan Der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorElsinger, Georg
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVan Der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecElsinger, Georg::0000-0001-6197-0762
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecCherman, Vladimir::0000-0002-8068-9236
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2025-01-22T15:53:25Z
dc.date.available2024-08-31T17:33:22Z
dc.date.available2025-01-22T15:53:25Z
dc.date.issued2024
dc.identifier.doi10.1109/TCPMT.2024.3421585
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44390
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage1180
dc.source.endpage1188
dc.source.issue7
dc.source.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
dc.source.numberofpages9
dc.source.volume14
dc.subject.keywordsHEAT-TRANSFER
dc.title

Modeling-Based Improvement of Microscale Liquid Jet Impingement Cooling

dc.typeJournal article
dspace.entity.typePublication
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