Publication:

Demonstration of a cost effective Cu electroless TSV metallization scheme

Date

2015
Proceedings Paper
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dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorLi, Yunlong
dc.contributor.authorDictus, Dries
dc.contributor.authorFrees, Bart
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorKondo, M.
dc.contributor.authorSeino, T.
dc.contributor.authorHeylen, Nancy
dc.contributor.authorStruyf, Herbert
dc.contributor.authorvan der Veen, Marleen
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorDictus, Dries
dc.contributor.imecauthorFrees, Bart
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecDictus, Dries::0000-0002-7896-1747
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.date.accessioned2021-10-23T00:22:13Z
dc.date.available2021-10-23T00:22:13Z
dc.date.embargo9999-12-31
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26099
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7325618
dc.source.beginpage197
dc.source.conferenceInternational Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM
dc.source.conferencedate18/05/2015
dc.source.conferencelocationGrenoble France
dc.source.endpage200
dc.title

Demonstration of a cost effective Cu electroless TSV metallization scheme

dc.typeProceedings paper
dspace.entity.typePublication
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