Publication:
Testing of 2.5D- and 3D-stacked integrated circuits
Date
| dc.contributor.author | Marinissen, Erik Jan | |
| dc.contributor.imecauthor | Marinissen, Erik Jan | |
| dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
| dc.date.accessioned | 2021-10-24T08:46:05Z | |
| dc.date.available | 2021-10-24T08:46:05Z | |
| dc.date.issued | 2017-09 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/28918 | |
| dc.source.conference | SEMICON Taiwan - IEEE International Test Conference Asia - ITC-Asia | |
| dc.source.conferencedate | 13/09/2017 | |
| dc.source.conferencelocation | Taipei Taiwan | |
| dc.title | Testing of 2.5D- and 3D-stacked integrated circuits | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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