Publication:
Optimising the solder joint reliability of polymer stud grid array (PSGATM) packages using thermo-mechanical analysis
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2004 since deposited on 2021-09-30
1last month
Acq. date: 2026-04-27
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2004 since deposited on 2021-09-30
1last month
Acq. date: 2026-04-27
Citations