Publication:

Optimising the solder joint reliability of polymer stud grid array (PSGATM) packages using thermo-mechanical analysis

Date

Loading...
Thumbnail Image

Abstract

Description

Metrics

Views

2003 since deposited on 2021-09-30
Acq. date: 2026-01-11

Citations

Metrics

Views

2003 since deposited on 2021-09-30
Acq. date: 2026-01-11

Citations