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Emerging Technologies for 3D Advanced Packaging
Publication:
Emerging Technologies for 3D Advanced Packaging
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Date
2020
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Jourdain, Anne
;
Miller, Andy
;
Beyne, Eric
Journal
Abstract
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1809
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Acq. date: 2025-12-15
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Metrics
Views
1809
since deposited on 2021-10-28
1
last month
1
last week
Acq. date: 2025-12-15
Citations