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Multi-channel Flip-chip RSOA InP-SiN ECL Array integrated on a 200mm Si Photonics Platform

 
dc.contributor.authorWang, Hsiao-Lun
dc.contributor.authorKumari, Sulakshna
dc.contributor.authorLeech, Damien
dc.contributor.authorSar, Huseyin
dc.contributor.authorGolshani, Negin
dc.contributor.authorKazakov, Dmitry
dc.contributor.authorMarinins, Aleksandrs
dc.contributor.authorCaer, Charles
dc.contributor.authorDe Koninck, Yannick
dc.contributor.authorSmith, Stuart
dc.contributor.authorMcKee, Andrew
dc.contributor.authorStephen, Sam
dc.contributor.authorHaensch, Sebastian
dc.contributor.authorKennes, Koen
dc.contributor.authorChakrabarti, Maumita
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorVerheyen, Peter
dc.contributor.authorFerraro, Filippo
dc.contributor.authorBan, Yoojin
dc.contributor.authorVan Campenhout, Joris
dc.contributor.imecauthorWang, Hsiao-Lun
dc.contributor.imecauthorKumari, Sulakshna
dc.contributor.imecauthorLeech, Damien
dc.contributor.imecauthorSar, Huseyin
dc.contributor.imecauthorGolshani, Negin
dc.contributor.imecauthorKazakov, Dmitry
dc.contributor.imecauthorMarinins, Aleksandrs
dc.contributor.imecauthorCaer, Charles
dc.contributor.imecauthorDe Koninck, Yannick
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorChakrabarti, Maumita
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorVerheyen, Peter
dc.contributor.imecauthorFerraro, Filippo
dc.contributor.imecauthorBan, Yoojin
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.orcidimecLeech, Damien::0000-0002-7202-5392
dc.contributor.orcidimecSar, Huseyin::0000-0002-4993-1258
dc.contributor.orcidimecGolshani, Negin::0000-0002-1299-0641
dc.contributor.orcidimecKazakov, Dmitry::0000-0001-8769-0478
dc.contributor.orcidimecMarinins, Aleksandrs::0000-0002-0728-6684
dc.contributor.orcidimecCaer, Charles::0000-0002-2735-2423
dc.contributor.orcidimecKennes, Koen::0000-0002-5987-2167
dc.contributor.orcidimecChakrabarti, Maumita::0000-0003-4584-0399
dc.contributor.orcidimecVelenis, Dimitrios::0000-0001-7947-8098
dc.contributor.orcidimecVerheyen, Peter::0000-0002-8245-9442
dc.contributor.orcidimecFerraro, Filippo::0000-0002-9328-5548
dc.contributor.orcidimecBan, Yoojin::0000-0001-7319-8132
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.date.accessioned2025-06-05T08:55:05Z
dc.date.available2025-05-03T05:30:38Z
dc.date.available2025-06-05T08:55:05Z
dc.date.issued2024
dc.description.wosFundingTextThis work was supported by imec's industry-affiliation R&D program "Optical I/O". We also thank the collaborative relationship with Sivers Photonics and ASMPT. This project has received funding from the PhotonDelta National Growth Fund programma.
dc.identifier.doi10.1109/IPC60965.2024.10799827
dc.identifier.eisbn979-8-3503-6195-7
dc.identifier.isbn979-8-3503-6196-4
dc.identifier.issn2374-0140
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45586
dc.publisherIEEE
dc.source.conference2024 IEEE Photonics Conference
dc.source.conferencedateNOV 10-14, 2024
dc.source.conferencelocationRome
dc.source.journalN/A
dc.source.numberofpages2
dc.title

Multi-channel Flip-chip RSOA InP-SiN ECL Array integrated on a 200mm Si Photonics Platform

dc.typeProceedings paper
dspace.entity.typePublication
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