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Extremely small fabrication tolerant InP-based power-splitting and combining structures by deep etching

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dc.contributor.authorSpiekman, L. H.
dc.contributor.authorOei, Y. S.
dc.contributor.authorMetaal, E. G.
dc.contributor.authorGroen, F. H.
dc.contributor.authorMoerman, Ingrid
dc.contributor.authorSmit, M. K.
dc.contributor.authorVerbeek, B. H.
dc.contributor.imecauthorMoerman, Ingrid
dc.date.accessioned2021-09-29T12:48:19Z
dc.date.available2021-09-29T12:48:19Z
dc.date.embargo9999-12-31
dc.date.issued1994
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/366
dc.source.beginpage665
dc.source.conferenceECOC'94: 20th European Conference on Optical Communication
dc.source.conferencedate25/09/1994
dc.source.conferencelocationFirenze Italy
dc.source.endpage668
dc.title

Extremely small fabrication tolerant InP-based power-splitting and combining structures by deep etching

dc.typeProceedings paper
dspace.entity.typePublication
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