Publication:

Two Metal Level Semi-Damascene Interconnects for Superconducting Digital Logic

Date

2024
Proceedings Paper
https://doi.org/10.1109/IITC61274.2024.10732342
Simple item page Full metadata Statistics
 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0003-3098-3266
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0009-0006-1899-8210
cris.virtual.orcid0000-0003-3545-3424
cris.virtual.orcid0000-0003-2329-5449
cris.virtual.orcid0000-0002-3684-5959
cris.virtual.orcid0009-0006-7501-9787
cris.virtual.orcid0000-0003-0211-0847
cris.virtual.orcid0009-0009-7686-4474
cris.virtual.orcid0000-0002-5956-6485
cris.virtual.orcid0000-0002-6833-220X
cris.virtual.orcid0000-0002-8471-6297
cris.virtual.orcid0000-0001-8406-8122
cris.virtual.orcid0000-0003-4084-5705
cris.virtual.orcid0000-0001-9247-0090
cris.virtual.orcid0009-0008-2524-3611
cris.virtualsource.departmentac970577-14d8-401d-8a09-e2e81baa0fa7
cris.virtualsource.departmente05093c4-13d7-446c-80d9-9d5407875f83
cris.virtualsource.departmentcbfc5c51-4cea-4272-85dc-c629cf03f025
cris.virtualsource.department5345513e-14d5-47e9-a494-1dda4ed18864
cris.virtualsource.departmente3892fcf-6afa-4c46-b0bb-e8bfd007fcc8
cris.virtualsource.department0f6970e3-389f-45a0-9b0b-725086d5a539
cris.virtualsource.department142233a1-23aa-4920-8aa7-ea5d1b32e137
cris.virtualsource.department0358e3bf-104e-431c-a10d-62c71b36f250
cris.virtualsource.departmentaca5cb03-d1db-4889-a004-6b31bdca1901
cris.virtualsource.departmentc1bbf7c6-fe00-4d3e-9b77-5ac76d18c50a
cris.virtualsource.department0ec81bcc-d43f-4489-99f0-e6cd9aa2c9a4
cris.virtualsource.department4a8262a6-f4c4-4846-b4dd-3b695db98f65
cris.virtualsource.department17a768fd-260a-4a64-9d1a-4fc5049fb236
cris.virtualsource.department4c195e49-8823-4ccc-a8c3-743b2d9c00cf
cris.virtualsource.department802fe4ec-2cc9-4395-9e66-18049db55e52
cris.virtualsource.department26141b2a-ede3-4919-9e53-c785c2daa035
cris.virtualsource.orcidac970577-14d8-401d-8a09-e2e81baa0fa7
cris.virtualsource.orcide05093c4-13d7-446c-80d9-9d5407875f83
cris.virtualsource.orcidcbfc5c51-4cea-4272-85dc-c629cf03f025
cris.virtualsource.orcid5345513e-14d5-47e9-a494-1dda4ed18864
cris.virtualsource.orcide3892fcf-6afa-4c46-b0bb-e8bfd007fcc8
cris.virtualsource.orcid0f6970e3-389f-45a0-9b0b-725086d5a539
cris.virtualsource.orcid142233a1-23aa-4920-8aa7-ea5d1b32e137
cris.virtualsource.orcid0358e3bf-104e-431c-a10d-62c71b36f250
cris.virtualsource.orcidaca5cb03-d1db-4889-a004-6b31bdca1901
cris.virtualsource.orcidc1bbf7c6-fe00-4d3e-9b77-5ac76d18c50a
cris.virtualsource.orcid0ec81bcc-d43f-4489-99f0-e6cd9aa2c9a4
cris.virtualsource.orcid4a8262a6-f4c4-4846-b4dd-3b695db98f65
cris.virtualsource.orcid17a768fd-260a-4a64-9d1a-4fc5049fb236
cris.virtualsource.orcid4c195e49-8823-4ccc-a8c3-743b2d9c00cf
cris.virtualsource.orcid802fe4ec-2cc9-4395-9e66-18049db55e52
cris.virtualsource.orcid26141b2a-ede3-4919-9e53-c785c2daa035
dc.contributor.authorIraci, Sara
dc.contributor.authorPokhrel, Ankit
dc.contributor.authorPerez Lozano, Daniel
dc.contributor.authorSoulie, Jean-Philippe
dc.contributor.authorSarkar, Sujan Kumar
dc.contributor.authorSaroj, Rajendra Kumar
dc.contributor.authorCanvel, Yann
dc.contributor.authorRenaud, Vincent
dc.contributor.authorWalke, Amey
dc.contributor.authorKenens, Bart
dc.contributor.authorHodges, Blake
dc.contributor.authorIbrahim, Seifallah
dc.contributor.authorJosephsen, Trent
dc.contributor.authorHuet, Benjamin
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorKim, Min-Soo
dc.contributor.authorO'Neal, Sabine
dc.contributor.authorHerr, Quentin
dc.contributor.authorHerr, Anna
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorIraci, Sara
dc.contributor.imecauthorPokhrel, Ankit
dc.contributor.imecauthorSoulie, Jean-Philippe
dc.contributor.imecauthorSarkar, Sujan Kumar
dc.contributor.imecauthorSaroj, Rajendra Kumar
dc.contributor.imecauthorCanvel, Yann
dc.contributor.imecauthorRenaud, Vincent
dc.contributor.imecauthorKenens, Bart
dc.contributor.imecauthorHodges, Blake
dc.contributor.imecauthorHuet, Benjamin
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorKim, Min-Soo
dc.contributor.imecauthorHerr, Anna
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorPerez Lozano, Daniel
dc.contributor.imecauthorWalke, Amey
dc.contributor.orcidimecIraci, Sara::0009-0006-1899-8210
dc.contributor.orcidimecPokhrel, Ankit::0009-0008-2524-3611
dc.contributor.orcidimecSoulie, Jean-Philippe::0000-0002-5956-6485
dc.contributor.orcidimecSarkar, Sujan Kumar::0000-0002-8471-6297
dc.contributor.orcidimecSaroj, Rajendra Kumar::0000-0002-3684-5959
dc.contributor.orcidimecCanvel, Yann::0009-0006-7501-9787
dc.contributor.orcidimecRenaud, Vincent::0009-0009-7686-4474
dc.contributor.orcidimecKenens, Bart::0000-0003-2329-5449
dc.contributor.orcidimecHuet, Benjamin::0000-0003-4084-5705
dc.contributor.orcidimecMurdoch, Gayle::0000-0002-6833-220X
dc.contributor.orcidimecKim, Min-Soo::0000-0003-0211-0847
dc.contributor.orcidimecHerr, Anna::0000-0001-9247-0090
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.contributor.orcidimecPerez Lozano, Daniel::0000-0003-3098-3266
dc.contributor.orcidimecWalke, Amey::0000-0001-8406-8122
dc.date.accessioned2025-06-17T12:25:52Z
dc.date.available2025-03-06T20:46:06Z
dc.date.available2025-06-17T12:25:52Z
dc.date.issued2024
dc.description.wosFundingTextWork at imec VZW and imec USA is supported by imec INVEST+ and by Osceola County Florida. The authors would also like to acknowledge the support of imec's FAB team.
dc.identifier.doi10.1109/IITC61274.2024.10732342
dc.identifier.eisbn979-8-3503-8517-5
dc.identifier.isbn979-8-3503-8518-2
dc.identifier.issn2380-632X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45328
dc.publisherIEEE
dc.source.conference2024 International Interconnect Technology Conference
dc.source.conferencedateJUN 03-06, 2024
dc.source.conferencelocationSan Jose
dc.source.journalN/A
dc.source.numberofpages3
dc.title

Two Metal Level Semi-Damascene Interconnects for Superconducting Digital Logic

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions