Publication:

Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling

Date

2015
Journal article
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dc.contributor.authorNabiollahi, Nabi
dc.contributor.authorMoelans, Nele
dc.contributor.authorGonzalez, Mario
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorWilson, Chris
dc.contributor.authorCroes, Kristof
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-22T21:18:15Z
dc.date.available2021-10-22T21:18:15Z
dc.date.issued2015
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25679
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0026271415000293
dc.source.beginpage765
dc.source.endpage770
dc.source.issue5
dc.source.journalMicroelectronics Reliability
dc.source.volume55
dc.title

Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling

dc.typeJournal article
dspace.entity.typePublication
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