Publication:

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 μm

Date

2024
Proceedings Paper
https://doi.org/10.1109/ECTC51529.2024.00015
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dc.contributor.authorLin, Ye
dc.contributor.authorBex, Pieter
dc.contributor.authorKennes, Koen
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorDhakras, Prathamesh
dc.contributor.authorSuhard, Samuel
dc.contributor.authorGerets, Carine
dc.contributor.authorDewilde, Sven
dc.contributor.authorGeorgieva, Violeta
dc.contributor.authorJourdain, Anne
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorLin, Ye
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorDhakras, Prathamesh
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorDewilde, Sven
dc.contributor.imecauthorGeorgieva, Violeta
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecLin, Ye::0000-0002-0681-908X
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecKennes, Koen::0000-0002-5987-2167
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecDhakras, Prathamesh::0000-0003-4527-0533
dc.contributor.orcidimecSuhard, Samuel::0000-0002-6650-5947
dc.contributor.orcidimecGerets, Carine::0009-0007-2069-6032
dc.contributor.orcidimecDewilde, Sven::0000-0003-2269-2127
dc.contributor.orcidimecGeorgieva, Violeta::0000-0001-5770-1770
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecBeyer, Gerald::0009-0001-0376-866X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2025-04-10T14:43:13Z
dc.date.available2024-12-07T16:58:04Z
dc.date.available2025-04-10T14:43:13Z
dc.date.issued2024
dc.identifier.doi10.1109/ECTC51529.2024.00015
dc.identifier.eisbn979-8-3503-7598-5
dc.identifier.isbn979-8-3503-7599-2
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44954
dc.publisherIEEE COMPUTER SOC
dc.source.beginpage40
dc.source.conferenceIEEE 74th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 28-31, 2024
dc.source.conferencelocationDenver
dc.source.endpage44
dc.source.journalN/A
dc.source.numberofpages5
dc.title

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 μm

dc.typeProceedings paper
dspace.entity.typePublication
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