Publication:

Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene

Date

2001
Proceedings Paper
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dc.contributor.authorWaeterloos, Joost
dc.contributor.authorShaffer, E. O.
dc.contributor.authorStokich, T.
dc.contributor.authorHetzner, J.
dc.contributor.authorPrice, D.
dc.contributor.authorBooms, L.
dc.contributor.authorDonaton, R. A.
dc.contributor.authorBeyer, Gerald
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorCaluwaerts, Rudy
dc.contributor.authorStruyf, Herbert
dc.contributor.authorTokei, Zsolt
dc.contributor.authorVervoort, Iwan
dc.contributor.authorSjjmus, B.
dc.contributor.authorVos, I.
dc.contributor.authorMaex, Karen
dc.contributor.authorKomiya, Takayuki
dc.contributor.authorIwashita, J. M.
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorCaluwaerts, Rudy
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorMaex, Karen
dc.date.accessioned2021-10-14T18:22:11Z
dc.date.available2021-10-14T18:22:11Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5826
dc.source.beginpage60
dc.source.conferenceProceedings of the IEEE 2001 International Interconnect Technology Conference
dc.source.conferencedate1/06/2001
dc.source.conferencelocationBurlingame, CA USA
dc.source.endpage62
dc.title

Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene

dc.typeProceedings paper
dspace.entity.typePublication
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