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Convolution based compact thermal model application to the evaluation of the thermal impact of die-die interface including interconnections
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Convolution based compact thermal model application to the evaluation of the thermal impact of die-die interface including interconnections
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Date
2014
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Maggioni, Federica
;
Oprins, Herman
;
Beyne, Eric
;
De Wolf, Ingrid
;
Baelmans, Tine
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Acq. date: 2025-12-12
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1907
since deposited on 2021-10-22
2
last month
Acq. date: 2025-12-12
Citations