Publication:
Low cost adhesive flip-chip assembly technology using a combination of ICA & NCA
Date
| dc.contributor.author | Vanfleteren, Jan | |
| dc.contributor.imecauthor | Vanfleteren, Jan | |
| dc.contributor.orcidimec | Vanfleteren, Jan::0000-0002-9654-7304 | |
| dc.date.accessioned | 2021-10-14T23:47:32Z | |
| dc.date.available | 2021-10-14T23:47:32Z | |
| dc.date.issued | 2002 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/6995 | |
| dc.source.conference | The GOOD-DIE International Workshop CAST - Challenges for Advanced Semiconductor-die Technologies | |
| dc.source.conferencedate | 22/05/2002 | |
| dc.source.conferencelocation | Brugge Belgium | |
| dc.title | Low cost adhesive flip-chip assembly technology using a combination of ICA & NCA | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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