Publication:

Scalable transfer for industrial 2D-CMOS manufacturing

Date

2026
Journal article
https://doi.org/10.1038/s41565-026-02217-x
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-0282-8528
cris.virtual.orcid0000-0002-9647-7967
cris.virtualsource.departmentb75defcd-5254-4816-bb35-ccd8c5db1cb0
cris.virtualsource.department7e8c96eb-907f-48fd-b267-c70469907fb2
cris.virtualsource.orcidb75defcd-5254-4816-bb35-ccd8c5db1cb0
cris.virtualsource.orcid7e8c96eb-907f-48fd-b267-c70469907fb2
dc.contributor.authorBiswas, Chandan
dc.contributor.authorGhosh, Souvik
dc.contributor.authorBrems, Steven
dc.contributor.authorLiechti, Kenneth M.
dc.contributor.authorAkinwande, Deji
dc.date.accessioned2026-10-28T13:20:43Z
dc.date.available2026-10-28T13:20:43Z
dc.date.createdwos2026
dc.date.issued2026
dc.description.abstractFoundry-compatible transfer of two-dimensional materials is central to angstrom-era complementary FET logic, where atomically thin channels must be moved from growth wafers to target stacks without contamination, strain or interfacial damage. Scalable delamination, bonding and wafer-level metrology are needed to bridge lab-scale device performance with 300-mm CMOS manufacturing.
dc.description.wosFundingTextThis work was supported by the National Science Foundation (NSF) Future of Semiconductors (FuSe) grant #2329191. We also acknowledge funding through the imec IIAP Exploratory Logic Program, the 2D-PL pilot line project through Horizon Europe (101189797), and Horizon 2020 (952792) grant agreements. C.B. acknowledges Samsung research support. D.A. acknowledges the Cockrell Family Regents Chair Professorship.
dc.identifier.doi10.1038/s41565-026-02217-x
dc.identifier.issn1748-3387
dc.identifier.pmidMEDLINE:42486954
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/60624
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherNATURE PORTFOLIO
dc.source.beginpage1217
dc.source.endpage1221
dc.source.issue9
dc.source.journalNATURE NANOTECHNOLOGY
dc.source.numberofpages5
dc.source.volume21
dc.subject.keywordsGRAPHENE
dc.subject.keywordsCOPPER
dc.title

Scalable transfer for industrial 2D-CMOS manufacturing

dc.typeJournal article
dspace.entity.typePublication
imec.internal.crawledAt2026-09-07
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-09-07
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