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3D sequential stacked planar devices featuring low-temperature replacement metal gate junctionless top devices with improved reliability
Publication:
3D sequential stacked planar devices featuring low-temperature replacement metal gate junctionless top devices with improved reliability
Date
2018-11
Journal article
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40281.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandooren, Anne
;
Franco, Jacopo
;
Parvais, Bertrand
;
Wu, Zhicheng
;
Witters, Liesbeth
;
Walke, Amey
;
Li, Waikin
;
Peng, Lan
;
Deshpande, Veeresh Vidyadhar
;
Bufler, Fabian
;
Rassoul, Nouredine
;
Hellings, Geert
;
Jamieson, Geraldine
;
Inoue, Fumihiro
;
Verbinnen, Greet
;
Devriendt, Katia
;
Teugels, Lieve
;
Heylen, Nancy
;
Vecchio, Emma
;
Tao, Zheng
;
Rosseel, Erik
;
Vanherle, Wendy
;
Hikavyy, Andriy
;
Chan, BT
;
Ritzenthaler, Romain
;
Besnard, Guillaume
;
Schwarzenbach, Walter
;
Gaudin, Gweltaz
;
Radu, Ionut
;
Nguyen, Bich-Yen
;
Waldron, Niamh
;
De Heyn, Vincent
;
Mocuta, Dan
;
Collaert, Nadine
Journal
IEEE Transactions on Electron Devices
Abstract
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1
since deposited on 2021-10-26
Acq. date: 2025-10-23
Views
2005
since deposited on 2021-10-26
Acq. date: 2025-10-23
Citations
Metrics
Downloads
1
since deposited on 2021-10-26
Acq. date: 2025-10-23
Views
2005
since deposited on 2021-10-26
Acq. date: 2025-10-23
Citations