Publication:

3D sequential stacked planar devices featuring low-temperature replacement metal gate junctionless top devices with improved reliability

Date

2018-11
Journal article
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Author(s)

Vandooren, Anne  
;
Franco, Jacopo  
;
Parvais, Bertrand  
;
Wu, Zhicheng  
;
Witters, Liesbeth  
;
Walke, Amey  
;
Li, Waikin  
;
Peng, Lan  
;
Deshpande, Veeresh Vidyadhar
;
Bufler, Fabian  
;
Rassoul, Nouredine  
;
Hellings, Geert  
;
Jamieson, Geraldine  
;
Inoue, Fumihiro  
;
Verbinnen, Greet  
;
Devriendt, Katia  
;
Teugels, Lieve  
;
Heylen, Nancy  
;
Vecchio, Emma  
;
Tao, Zheng  
;
Rosseel, Erik  
;
Vanherle, Wendy  
;
Hikavyy, Andriy  
;
Chan, BT  
;
Ritzenthaler, Romain  
;
Besnard, Guillaume  
;
Schwarzenbach, Walter
;
Gaudin, Gweltaz
;
Radu, Ionut
;
Nguyen, Bich-Yen
;
Waldron, Niamh  
;
De Heyn, Vincent  
;
Mocuta, Dan
;
Collaert, Nadine  

Journal

IEEE Transactions on Electron Devices

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Citations