Publication:
Glyoxylic acid as reducing agent for electroless copper deposition on cobalt liner
Date
| dc.contributor.author | Inoue, Fumihiro | |
| dc.contributor.author | Philipsen, Harold | |
| dc.contributor.author | van der Veen, Marleen | |
| dc.contributor.author | Van Huylenbroeck, Stefaan | |
| dc.contributor.author | Armini, Silvia | |
| dc.contributor.author | Struyf, Herbert | |
| dc.contributor.author | Shingubara, Shoso | |
| dc.contributor.author | Tanaka, Tetsu | |
| dc.contributor.imecauthor | Inoue, Fumihiro | |
| dc.contributor.imecauthor | Philipsen, Harold | |
| dc.contributor.imecauthor | van der Veen, Marleen | |
| dc.contributor.imecauthor | Van Huylenbroeck, Stefaan | |
| dc.contributor.imecauthor | Armini, Silvia | |
| dc.contributor.imecauthor | Struyf, Herbert | |
| dc.contributor.orcidimec | Philipsen, Harold::0000-0002-5029-1104 | |
| dc.contributor.orcidimec | van der Veen, Marleen::0000-0002-9402-8922 | |
| dc.contributor.orcidimec | Van Huylenbroeck, Stefaan::0000-0001-9978-3575 | |
| dc.contributor.orcidimec | Armini, Silvia::0000-0003-0578-3422 | |
| dc.date.accessioned | 2021-10-22T19:50:50Z | |
| dc.date.available | 2021-10-22T19:50:50Z | |
| dc.date.issued | 2015 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/25415 | |
| dc.identifier.url | http://ecst.ecsdl.org/content/64/40/63.full.pdf | |
| dc.source.beginpage | 63 | |
| dc.source.conference | Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6 | |
| dc.source.conferencedate | 5/10/2014 | |
| dc.source.conferencelocation | Cancun Mexico | |
| dc.source.endpage | 75 | |
| dc.title | Glyoxylic acid as reducing agent for electroless copper deposition on cobalt liner | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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