Post-etch template removal strategy for reduction of plasma induced damage in spin-on OSG low-k dielectrics

dc.contributor.author	Krishtab, Mikhail
dc.contributor.author	Vanstreels, Kris
dc.contributor.author	Baklanov, Mikhaïl
dc.contributor.author	De Gendt, Stefan
dc.contributor.imecauthor	Krishtab, Mikhail
dc.contributor.imecauthor	Vanstreels, Kris
dc.contributor.imecauthor	De Gendt, Stefan
dc.contributor.orcidimec	Vanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimec	De Gendt, Stefan::0000-0003-3775-3578
dc.date.accessioned	2021-10-22T20:13:59Z
dc.date.available	2021-10-22T20:13:59Z
dc.date.embargo	9999-12-31
dc.date.issued	2015
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/25491
dc.identifier.url	http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7325642
dc.source.beginpage	103
dc.source.conference	IEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM
dc.source.conferencedate	18/05/2015
dc.source.conferencelocation	Grenoble France
dc.source.endpage	106
dc.title	Post-etch template removal strategy for reduction of plasma induced damage in spin-on OSG low-k dielectrics
dc.type	Proceedings paper
dspace.entity.type	Publication
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