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Process window and defect monitoring using high-throughput e-beam inspection guided by computational hot spot detection

Date

2016
Proceedings Paper
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dc.contributor.authorWang, Fei
dc.contributor.authorZhang, Pencheng
dc.contributor.authorFang, Wei
dc.contributor.authorLiu, Kevin
dc.contributor.authorJau, Jack
dc.contributor.authorWang, Lester
dc.contributor.authorWan, Alex
dc.contributor.authorHunsche, Stefan
dc.contributor.authorHalder, Sandip
dc.contributor.authorLeray, Philippe
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorLeray, Philippe
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.date.accessioned2021-10-23T16:59:21Z
dc.date.available2021-10-23T16:59:21Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27565
dc.identifier.urlhttp://proceedings.spiedigitallibrary.org/proceeding.aspx?articleid=2507366
dc.source.beginpage97783F
dc.source.conferenceMetrology, Inspection, and Process Control for Microlithography XXX
dc.source.conferencedate20/02/2016
dc.source.conferencelocationSan Jose, CA USA
dc.title

Process window and defect monitoring using high-throughput e-beam inspection guided by computational hot spot detection

dc.typeProceedings paper
dspace.entity.typePublication
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