Publication:

Demonstration of a novel low cost single material temporary bond solution for high topography substrates based on a mechanical wafer debonding and innovative adhesive removal

Date

2015
Proceedings Paper
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dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorNakamura, Atsushi
dc.contributor.authorJourdain, Anne
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorKamochi, Yoshitaka
dc.contributor.authorKoyama, Ichiro
dc.contributor.authorIwai, Yu
dc.contributor.authorSawano, Mitsuru
dc.contributor.authorTan, Shiro
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorSleeckx, Erik
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T21:49:49Z
dc.date.available2021-10-22T21:49:49Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25759
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7159785
dc.source.beginpage1430
dc.source.conferenceIEEE 65th Electronic Components & Technology Conference - ECTC
dc.source.conferencedate26/05/2015
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage1435
dc.title

Demonstration of a novel low cost single material temporary bond solution for high topography substrates based on a mechanical wafer debonding and innovative adhesive removal

dc.typeProceedings paper
dspace.entity.typePublication
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