Publication:

An MCM-D laser driver hybrid with RF amplifier chip, combining advanced FC assembly and novel single chip bumping technology

Date

2000
Proceedings Paper
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dc.contributor.authorDe Pauw, Herbert
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorDe Smet, Herbert
dc.contributor.authorZhang, S.
dc.contributor.authorVan Calster, Andre
dc.contributor.imecauthorDe Pauw, Herbert
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorDe Smet, Herbert
dc.contributor.imecauthorVan Calster, Andre
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned2021-10-14T12:49:19Z
dc.date.available2021-10-14T12:49:19Z
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4271
dc.source.beginpage557
dc.source.conferenceInternational Conference and Exhibition on High Density Interconnect and Systems Packaging; Aprl 2000; Denver, Co, USA.
dc.source.conferencelocation
dc.source.endpage562
dc.title

An MCM-D laser driver hybrid with RF amplifier chip, combining advanced FC assembly and novel single chip bumping technology

dc.typeProceedings paper
dspace.entity.typePublication
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