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Influence of electrochemical plating process parameters on corrosion of Cu damascene interconnects
Publication:
Influence of electrochemical plating process parameters on corrosion of Cu damascene interconnects
Date
2004
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ernur, Didem
;
Wu, Wen
;
Brongersma, Sywert
;
Terzieva, Valentina
;
Maex, Karen
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Abstract
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1870
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations
Metrics
Views
1870
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations