Publication:

Reliability mechanisms and lifetime extrapolation methods for scaled interconnect technologies

Date

2015
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorCroes, Kristof
dc.contributor.authorWu, Chen
dc.contributor.authorKocaay, Deniz
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorWu, Chen
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecWu, Chen::0000-0002-4636-8842
dc.date.accessioned2021-10-22T18:46:45Z
dc.date.available2021-10-22T18:46:45Z
dc.date.embargo9999-12-31
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25114
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7325585
dc.source.beginpage295
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM
dc.source.conferencedate18/05/2015
dc.source.conferencelocationGrenoble France
dc.source.endpage298
dc.title

Reliability mechanisms and lifetime extrapolation methods for scaled interconnect technologies

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
31836.pdf
Size:
133.35 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions