Publication:
Test cost analysis for 3D die-to-wafer stacking
Date
| dc.contributor.author | Taouil, Mottaqiallah | |
| dc.contributor.author | Hamdioui, Said | |
| dc.contributor.author | Beenakker, Kees | |
| dc.contributor.author | Marinissen, Erik Jan | |
| dc.contributor.imecauthor | Marinissen, Erik Jan | |
| dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
| dc.date.accessioned | 2021-10-18T22:12:58Z | |
| dc.date.available | 2021-10-18T22:12:58Z | |
| dc.date.issued | 2010-12 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18069 | |
| dc.source.beginpage | 435 | |
| dc.source.conference | IEEE Asian Test Symposium - ATS | |
| dc.source.conferencedate | 1/12/2010 | |
| dc.source.conferencelocation | Shanghai China | |
| dc.source.endpage | 441 | |
| dc.title | Test cost analysis for 3D die-to-wafer stacking | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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