Publication:

Microstrip thin-film MCM-D technology on high-resistivity silicon with integrated through-substrate vias

Date

2007
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorPosada Quijano, Guillermo
dc.contributor.authorCarchon, Geert
dc.contributor.authorSoussan, Philippe
dc.contributor.authorPham, Nga
dc.contributor.authorMajeed, Bivragh
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorNauwelaers, Bart
dc.contributor.authorDe Raedt, Walter
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorPham, Nga
dc.contributor.imecauthorMajeed, Bivragh
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecMajeed, Bivragh::0000-0002-1535-4544
dc.date.accessioned2021-10-16T18:46:50Z
dc.date.available2021-10-16T18:46:50Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12733
dc.source.beginpage335
dc.source.conferenceEuropean Microwave Integrated Circuit Conference - EuMIC
dc.source.conferencedate8/10/2007
dc.source.conferencelocationMünchen Germany
dc.source.endpage338
dc.title

Microstrip thin-film MCM-D technology on high-resistivity silicon with integrated through-substrate vias

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions