Publication:
Polariscopy reveals TSV stress fields
Date
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.date.accessioned | 2021-10-23T10:29:51Z | |
| dc.date.available | 2021-10-23T10:29:51Z | |
| dc.date.issued | 2016 | |
| dc.identifier.issn | 1526-1344 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/26521 | |
| dc.identifier.url | http://www.chipscalereview.com/issue/1601/ChipScale_Jan-Feb_2016_interactive.pdf | |
| dc.source.beginpage | 7 | |
| dc.source.endpage | 9 | |
| dc.source.issue | Jan._Feb. | |
| dc.source.journal | Chip Scale Review | |
| dc.title | Polariscopy reveals TSV stress fields | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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