Publication:
Cu interconnects and low-k dielectrics, Challenges for chip interconnections and packaging
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1990 since deposited on 2021-10-15
4last month
1last week
Acq. date: 2025-12-15
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Views
1990 since deposited on 2021-10-15
4last month
1last week
Acq. date: 2025-12-15
Citations