Publication:
Electromigration in solder interconnects
Date
| dc.contributor.author | Labie, Riet | |
| dc.contributor.imecauthor | Labie, Riet | |
| dc.contributor.orcidimec | Labie, Riet::0000-0002-1401-1291 | |
| dc.date.accessioned | 2021-10-19T15:07:43Z | |
| dc.date.available | 2021-10-19T15:07:43Z | |
| dc.date.issued | 2011 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/19228 | |
| dc.source.beginpage | 161 | |
| dc.source.book | The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-free Solder Interconnects | |
| dc.source.endpage | 178 | |
| dc.title | Electromigration in solder interconnects | |
| dc.type | Book chapter | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |