Publication:

A novel resist and post-etch residue removal process using ozonated chemistry

Date

1999
Proceedings Paper
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dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorSnee, Peter
dc.contributor.authorCornelissen, Ingrid
dc.contributor.authorLux, Marcel
dc.contributor.authorVos, Rita
dc.contributor.authorMertens, Paul
dc.contributor.authorKnotter, D. M.
dc.contributor.authorMeuris, Marc
dc.contributor.authorHeyns, Marc
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.imecauthorCornelissen, Ingrid
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.date.accessioned2021-10-06T10:54:59Z
dc.date.available2021-10-06T10:54:59Z
dc.date.embargo9999-12-31
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3354
dc.source.beginpage165
dc.source.conferenceUltra Clean Processing of Silicon Surfaces; Proceedings of the 4th International Symposium on Ultra Clean Processing of Silicon
dc.source.conferencedate21/09/1998
dc.source.conferencelocationOostende Belgium
dc.source.endpage168
dc.title

A novel resist and post-etch residue removal process using ozonated chemistry

dc.typeProceedings paper
dspace.entity.typePublication
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