Publication:
The influence of the selectivity in a 2nd step slurry for a Cu CMP process
Date
| dc.contributor.author | Sijmus, Bram | |
| dc.contributor.author | Vos, Ingrid | |
| dc.contributor.author | Terzieva, Valentina | |
| dc.contributor.author | Meuris, Marc | |
| dc.contributor.author | Hernandez, Jose Luis | |
| dc.contributor.imecauthor | Vos, Ingrid | |
| dc.contributor.imecauthor | Terzieva, Valentina | |
| dc.contributor.imecauthor | Meuris, Marc | |
| dc.contributor.imecauthor | Hernandez, Jose Luis | |
| dc.contributor.orcidimec | Meuris, Marc::0000-0002-9580-6810 | |
| dc.date.accessioned | 2021-10-14T23:09:54Z | |
| dc.date.available | 2021-10-14T23:09:54Z | |
| dc.date.issued | 2002 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/6825 | |
| dc.source.beginpage | 380 | |
| dc.source.conference | 201st Meeting of the Electrochemical Society. 5th International Symposium on Chemical Mechanical Polishing (CMP) | |
| dc.source.conferencedate | 12/05/2002 | |
| dc.source.conferencelocation | Philadelphia, PA USA | |
| dc.title | The influence of the selectivity in a 2nd step slurry for a Cu CMP process | |
| dc.type | Meeting abstract | |
| dspace.entity.type | Publication | |
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