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The influence of the selectivity in a 2nd step slurry for a Cu CMP process

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dc.contributor.authorSijmus, Bram
dc.contributor.authorVos, Ingrid
dc.contributor.authorTerzieva, Valentina
dc.contributor.authorMeuris, Marc
dc.contributor.authorHernandez, Jose Luis
dc.contributor.imecauthorVos, Ingrid
dc.contributor.imecauthorTerzieva, Valentina
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorHernandez, Jose Luis
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.date.accessioned2021-10-14T23:09:54Z
dc.date.available2021-10-14T23:09:54Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6825
dc.source.beginpage380
dc.source.conference201st Meeting of the Electrochemical Society. 5th International Symposium on Chemical Mechanical Polishing (CMP)
dc.source.conferencedate12/05/2002
dc.source.conferencelocationPhiladelphia, PA USA
dc.title

The influence of the selectivity in a 2nd step slurry for a Cu CMP process

dc.typeMeeting abstract
dspace.entity.typePublication
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