Publication:

III-V/III-N technologies for next generation high-capacity wireless communication

Date

2022
Proceedings Paper
https://doi.org/10.1109/IEDM45625.2022.10019555
Simple item page Full metadata Statistics
 
dc.contributor.authorCollaert, Nadine
dc.contributor.authorAlian, AliReza
dc.contributor.authorBanerjee, Aritra
dc.contributor.authorBoccardi, Guillaume
dc.contributor.authorCardinael, Pieter
dc.contributor.authorChauhan, Vikas
dc.contributor.authorDesset, Claude
dc.contributor.authorElKashlan, Rana Y.
dc.contributor.authorKhaled, Ahmad
dc.contributor.authorIngels, Mark
dc.contributor.authorKunert, Bernardette
dc.contributor.authorMols, Yves
dc.contributor.authorO'Sullivan, Barry
dc.contributor.authorPeralagu, Uthayasankaran
dc.contributor.authorPinho, Nelson
dc.contributor.authorRodriguez, Raul
dc.contributor.authorSibaja-Hernandez, Arturo
dc.contributor.authorSinha, Siddhartha
dc.contributor.authorSun, Xiao
dc.contributor.authorVais, Abhitosh
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.imecauthorAlian, AliReza
dc.contributor.imecauthorBanerjee, Aritra
dc.contributor.imecauthorBoccardi, Guillaume
dc.contributor.imecauthorCardinael, Pieter
dc.contributor.imecauthorChauhan, Vikas
dc.contributor.imecauthorDesset, Claude
dc.contributor.imecauthorElKashlan, Rana Y.
dc.contributor.imecauthorKhaled, Ahmad
dc.contributor.imecauthorIngels, Mark
dc.contributor.imecauthorKunert, Bernardette
dc.contributor.imecauthorMols, Yves
dc.contributor.imecauthorO'Sullivan, Barry
dc.contributor.imecauthorPeralagu, Uthayasankaran
dc.contributor.imecauthorPinho, Nelson
dc.contributor.imecauthorRodriguez, Raul
dc.contributor.imecauthorSibaja-Hernandez, Arturo
dc.contributor.imecauthorSinha, Siddhartha
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorVais, Abhitosh
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.contributor.orcidimecAlian, AliReza::0000-0003-3463-416X
dc.contributor.orcidimecBanerjee, Aritra::0000-0001-7671-9669
dc.contributor.orcidimecBoccardi, Guillaume::0000-0003-3226-4572
dc.contributor.orcidimecCardinael, Pieter::0000-0002-8603-2497
dc.contributor.orcidimecChauhan, Vikas::0000-0003-0512-6916
dc.contributor.orcidimecDesset, Claude::0000-0002-5822-1688
dc.contributor.orcidimecElKashlan, Rana Y.::0000-0003-0576-4344
dc.contributor.orcidimecKhaled, Ahmad::0000-0003-2892-3176
dc.contributor.orcidimecIngels, Mark::0000-0003-1939-2422
dc.contributor.orcidimecKunert, Bernardette::0000-0002-8986-4109
dc.contributor.orcidimecMols, Yves::0000-0002-7072-0113
dc.contributor.orcidimecO'Sullivan, Barry::0000-0002-9036-8241
dc.contributor.orcidimecPeralagu, Uthayasankaran::0000-0001-9166-4408
dc.contributor.orcidimecRodriguez, Raul::0000-0002-4457-8942
dc.contributor.orcidimecSinha, Siddhartha::0000-0003-4025-2854
dc.contributor.orcidimecVais, Abhitosh::0000-0002-0317-7720
dc.contributor.orcidimecVermeersch, Bjorn::0000-0001-8640-672X
dc.contributor.orcidimecYadav, Sachin::0000-0003-4530-2603
dc.contributor.orcidimecYan, Dongyang::0000-0002-2048-3762
dc.date.accessioned2023-06-16T10:10:05Z
dc.date.available2023-05-25T20:20:02Z
dc.date.available2023-06-16T10:10:05Z
dc.date.issued2022
dc.description.wosFundingTextThe contributions of the Advanced RF and 3D system integration research teams at imec are acknowledged. This work is supported by imec's IIAP program members and partially supported by the H2020 project COREnect (Grant Agreement no. 956830).
dc.identifier.doi10.1109/IEDM45625.2022.10019555
dc.identifier.eisbn978-1-6654-8959-1
dc.identifier.issn2380-9248
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41625
dc.publisherIEEE
dc.source.conferenceInternational Electron Devices Meeting (IEDM)
dc.source.conferencedateDEC 03-07, 2022
dc.source.conferencelocationSan Francisco
dc.source.journalna
dc.source.numberofpages4
dc.title

III-V/III-N technologies for next generation high-capacity wireless communication

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions