Publication:

Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding

Date

2010-12
Book Chapter
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dc.contributor.authorSoussan, Philippe
dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorPhommahaxay, Alain
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.date.accessioned2021-10-18T21:50:47Z
dc.date.available2021-10-18T21:50:47Z
dc.date.embargo9999-12-31
dc.date.issued2010-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18022
dc.source.beginpage4
dc.source.bookSuss Report
dc.source.endpage5
dc.title

Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding

dc.typeBook chapter
dspace.entity.typePublication
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