Publication:
Cost-effective 3D-system integration using through silicon via technologies
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-16T15:05:09Z | |
| dc.date.available | 2021-10-16T15:05:09Z | |
| dc.date.issued | 2007 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/11736 | |
| dc.source.conference | International Microsystems, Packaging, Assembly and Circuits conference - IMPACT | |
| dc.source.conferencedate | 1/10/2007 | |
| dc.source.conferencelocation | Taipei Taiwan | |
| dc.title | Cost-effective 3D-system integration using through silicon via technologies | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
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