Publication:

High-throughput in-line SEM Metrology for Cu Pad Nanotopography for Hybrid Bonding Applications

Date

2024
Proceedings Paper
https://doi.org/10.1109/ESTC60143.2024.10712138
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Author(s)

Tunca Altintas, Bensu  
;
Saib, Mohamed  
;
Moussa, Alain  
;
Chew, Soon Aik  
;
Zhang, Boyao  
;
De Vos, Joeri  
;
Miller, Andy  
;
Beyne, Eric  
;
Lorusso, Gian  
;
Charley, Anne-Laure  
;
Bogdanowicz, Janusz  
;
Kasai, Hiroaki
;
Hasumi, Kazuhisa
;
Mise, Nobuyuki
;
Osaki, Mayuka
;
Tanaka, Maki

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N/A

Abstract

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257 since deposited on 2025-02-15
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Acq. date: 2026-04-28

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