Publication:
No Flux Thermocompression Bonding: Adapting to the Future
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0002-3096-050X | |
| cris.virtual.orcid | 0000-0003-2448-9165 | |
| cris.virtualsource.department | 67066e7b-3582-42ef-b040-694dc2e501ae | |
| cris.virtualsource.department | e506cc22-f003-4f27-bc24-12771348f7aa | |
| cris.virtualsource.orcid | 67066e7b-3582-42ef-b040-694dc2e501ae | |
| cris.virtualsource.orcid | e506cc22-f003-4f27-bc24-12771348f7aa | |
| dc.contributor.author | Abdilla, Jonathan | |
| dc.contributor.author | Kainz, Martin | |
| dc.contributor.author | Pressl, Benedikt | |
| dc.contributor.author | Faubaum, Mario | |
| dc.contributor.author | Scanlan, Chris | |
| dc.contributor.author | Derakhshandeh, Jaber | |
| dc.contributor.author | Beyne, Eric | |
| dc.date.accessioned | 2026-06-04T13:53:58Z | |
| dc.date.available | 2026-06-04T13:53:58Z | |
| dc.date.createdwos | 2025-11-01 | |
| dc.date.issued | 2025 | |
| dc.description.abstract | To cater for the demands for fine pitch applications TCB is being revamped to reach sub 20μ m pitch bonding. This however requires new packaging approaches as the standard way with flux dipping or non-conducting film (NCF) is not suitable for several reasons which are outlined in this work. The new TCB modes are presented together with results from actual sample builds. Literature explaining the mode of operation and chemical reactions of this new method is also outlined. We explore also Copper-Copper (Cu-Cu) solderless bonding and show some results as well as well as the factors which impact this mode of interconnect. We give an overview of what a bonder capable of such processes looks like and its key features as well as some data to backup the claims. | |
| dc.description.wosFundingText | The authors would like to extend their sincere appreciation to the members of the Besi Austria process development group and advanced technology group for their invaluable assistance and contributions. Their expertise and support greatly contributed to the quality of this paper. Thanks also to the colleagues at IMEC for their support. Special thanks also go to the Resonac team for providing material with their polymer coating and supporting the sample builds. Parts of this work have received funding from the European Union's Horizon research and innovation program under grant agreement No 101075725 and from the Austrian Research Promotion Agency (FFG) for the projects TC MoreThanMoore. This work is supported by the Chips JU project ARCTIC (Project #101139908). The project is supported by the Chips Joint Undertaking and its members (including top-up funding by Belgium, Austria, Germany, Estonia, Finland, France, Ireland, The Netherlands and Sweden). ARCTIC gratefully acknowledges the support of the Canadian and the Swiss federal governments. | |
| dc.identifier.doi | 10.1109/ectc51687.2025.00010 | |
| dc.identifier.isbn | 979-8-3315-3933-7 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/59573 | |
| dc.language.iso | eng | |
| dc.provenance.editstepuser | greet.vanhoof@imec.be | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 25 | |
| dc.source.conference | IEEE 75th Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | 2025-05-27 | |
| dc.source.conferencelocation | Dallas | |
| dc.source.endpage | 32 | |
| dc.source.journal | 2025 IEEE 75TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC | |
| dc.source.numberofpages | 8 | |
| dc.title | No Flux Thermocompression Bonding: Adapting to the Future | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| imec.internal.crawledAt | 2026-04-07 | |
| imec.internal.source | crawler | |
| imec.internal.wosCreatedAt | 2026-04-07 | |
| Files | ||
| Publication available in collections: |