Publication:

High alignment accuracy transfer printing of silicon coupons for heterogeneously integratred PICs

Date

2017
Proceedings Paper
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dc.contributor.authorMuliuk, Grigorij
dc.contributor.authorYe, Nan
dc.contributor.authorTrindade, A.J.
dc.contributor.authorBower, C.
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorRoelkens, Gunther
dc.contributor.imecauthorMuliuk, Grigorij
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.date.accessioned2021-10-24T09:45:45Z
dc.date.available2021-10-24T09:45:45Z
dc.date.embargo9999-12-31
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29036
dc.source.beginpage48
dc.source.conferenceSymposium IEEE Photonics Society Benelux
dc.source.conferencedate27/11/2017
dc.source.conferencelocationDelft The Netherlands
dc.source.endpage51
dc.title

High alignment accuracy transfer printing of silicon coupons for heterogeneously integratred PICs

dc.typeProceedings paper
dspace.entity.typePublication
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