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Optimization of through Si via last microlithography for 3D packaging
Publication:
Optimization of through Si via last microlithography for 3D packaging
Date
2015
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Slabbekoorn, John
;
Tobback, Bert
;
Vandeweyer, Tom
;
Miller, Andy
;
Flack, Warren
;
Hsieh, Robert
;
Kenyon, Gareth
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1884
since deposited on 2021-10-22
Acq. date: 2025-10-23
Citations
Metrics
Views
1884
since deposited on 2021-10-22
Acq. date: 2025-10-23
Citations