Publication:

Beyond-Cu Intermediate-Length Interconnect Exploration for SRAM Application

Date

2022
Journal article
https://doi.org/10.1109/TNANO.2022.3157952
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dc.contributor.authorPei, Zhenlin
dc.contributor.authorCatthoor, Francky
dc.contributor.authorTokei, Zsolt
dc.contributor.authorPan, Chenyun
dc.contributor.imecauthorCatthoor, Francky
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCatthoor, Francky::0000-0002-3599-8515
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.date.accessioned2022-08-31T08:07:36Z
dc.date.available2022-08-09T02:37:56Z
dc.date.available2022-08-14T07:47:14Z
dc.date.available2022-08-31T08:07:36Z
dc.date.embargo2022-03-09
dc.date.issued2022
dc.description.wosFundingTextThis work was supported by IMEC.
dc.identifier.doi10.1109/TNANO.2022.3157952
dc.identifier.issn1536-125X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40235
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage367
dc.source.endpage373
dc.source.issuena
dc.source.journalIEEE TRANSACTIONS ON NANOTECHNOLOGY
dc.source.numberofpages7
dc.source.volume21
dc.subject.keywordsTECHNOLOGY
dc.subject.keywordsGRAPHENE
dc.subject.keywordsMULTIGATE
dc.subject.keywordsIntermediate-Length Interconnect Exploration, SRAM
dc.title

Beyond-Cu Intermediate-Length Interconnect Exploration for SRAM Application

dc.typeJournal article
dspace.entity.typePublication
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