Publication:

Comparison of the electromigration behavior of Al(MgCu) with Al(Cu) and Al(SiCu)

Date

1998
Proceedings Paper
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dc.contributor.authorLi, Hua
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorJin, S.
dc.contributor.authorBender, Hugo
dc.contributor.authorMaex, Karen
dc.contributor.authorFroyen, L.
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorMaex, Karen
dc.date.accessioned2021-10-01T08:29:00Z
dc.date.available2021-10-01T08:29:00Z
dc.date.embargo9999-12-31
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2724
dc.source.beginpage133
dc.source.conferenceAdvanced Interconnects and Contact Materials and Processes for Future Integrated Circuits
dc.source.conferencedate13/04/1998
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage138
dc.title

Comparison of the electromigration behavior of Al(MgCu) with Al(Cu) and Al(SiCu)

dc.typeProceedings paper
dspace.entity.typePublication
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