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A novel low temperature etch approach to reduce ULK plasma damage
Publication:
A novel low temperature etch approach to reduce ULK plasma damage
Date
2015
Meeting abstract
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31902.pdf
381.68 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Zhang, Liping
;
de Marneffe, Jean-Francois
;
Leroy, F.
;
Ljazouli, R.
;
Lefaucheux, P.
;
Tillocher, T
;
Dussart, R.
;
Maekawa, K.
;
Yatsuda, K.
;
Dussarrat, C.
;
De Gendt, Stefan
;
Baklanov, Mikhaïl
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Abstract
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2026
since deposited on 2021-10-23
Acq. date: 2025-10-23
Citations
Metrics
Views
2026
since deposited on 2021-10-23
Acq. date: 2025-10-23
Citations