Texture characterization of Cu interconnects with different Ta-based sidewall diffusion barriers

dc.contributor.author	Wilson, Chris
dc.contributor.author	Zhao, Chao
dc.contributor.author	Volders, Henny
dc.contributor.author	Zhao, Larry
dc.contributor.author	Croes, Kristof
dc.contributor.author	Tokei, Zsolt
dc.contributor.author	Beyer, Gerald
dc.contributor.imecauthor	Wilson, Chris
dc.contributor.imecauthor	Volders, Henny
dc.contributor.imecauthor	Croes, Kristof
dc.contributor.imecauthor	Tokei, Zsolt
dc.contributor.imecauthor	Beyer, Gerald
dc.contributor.orcidimec	Croes, Kristof::0000-0002-3955-0638
dc.date.accessioned	2021-10-19T21:49:41Z
dc.date.available	2021-10-19T21:49:41Z
dc.date.issued	2011
dc.identifier.issn	0167-9317
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/20150
dc.identifier.url	http://dx.doi.org/10.1016/j.mee.2010.06.014
dc.source.beginpage	656
dc.source.endpage	660
dc.source.issue	5
dc.source.journal	Microelectronic Engineering
dc.source.volume	88
dc.title	Texture characterization of Cu interconnects with different Ta-based sidewall diffusion barriers
dc.type	Journal article
dspace.entity.type	Publication
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