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The effect of deposition and annealing conditions on the stress in metallization materials for VLSI interconnects
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The effect of deposition and annealing conditions on the stress in metallization materials for VLSI interconnects
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Date
1994
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Witvrouw, Ann
;
Maex, Karen
Journal
Abstract
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1908
since deposited on 2021-09-29
Acq. date: 2025-12-15
Citations
Metrics
Views
1908
since deposited on 2021-09-29
Acq. date: 2025-12-15
Citations