Publication:

Assessment of STI dry etch process variability by means of dynamic time warping technique

Date

2023
Journal article
https://doi.org/10.35848/1347-4065/acbbd6
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dc.contributor.authorMilenin, Alexey
dc.contributor.authorChan, BT
dc.contributor.authorLazzarino, Frederic
dc.contributor.imecauthorMilenin, Alexey
dc.contributor.imecauthorChan, BT
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecMilenin, Alexey::0000-0003-0747-0462
dc.contributor.orcidimecChan, BT::0000-0003-2890-0388
dc.date.accessioned2023-07-07T08:29:00Z
dc.date.available2023-04-03T04:00:13Z
dc.date.available2023-07-07T08:29:00Z
dc.date.embargo9999-12-31
dc.date.issued2023
dc.identifier.doi10.35848/1347-4065/acbbd6
dc.identifier.issn0021-4922
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41418
dc.publisherIOP Publishing Ltd
dc.source.beginpageArt. SI1004
dc.source.endpagena
dc.source.issueSI
dc.source.journalJAPANESE JOURNAL OF APPLIED PHYSICS
dc.source.numberofpages5
dc.source.volume62
dc.title

Assessment of STI dry etch process variability by means of dynamic time warping technique

dc.typeJournal article
dspace.entity.typePublication
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