Publication:

Heterogeneous integration for silicon photonics based on micro-transfer printing

Date

2025
Proceedings Paper
https://doi.org/10.1109/ecoc66593.2025.11263358
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-4667-5092
cris.virtualsource.departmentb32be2a6-49e5-4859-8aac-84fd4f5bec8e
cris.virtualsource.orcidb32be2a6-49e5-4859-8aac-84fd4f5bec8e
dc.contributor.authorRoelkens, Gunther
dc.date.accessioned2026-06-08T13:29:03Z
dc.date.available2026-06-08T13:29:03Z
dc.date.createdwos2026-03-04
dc.date.issued2025
dc.description.abstractMicro-transfer printing is an enabling technology to heterogeneously integrate thin-film components onto silicon photonics wafers. This tutorial will cover the basics of micro-transfer printing as well as demonstrations such as GaAs and InP opto-electronic device integration, LiNbO3 modulator integration and electronic IC integration.
dc.identifier.doi10.1109/ecoc66593.2025.11263358
dc.identifier.isbn979-8-3315-9532-6
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59629
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE
dc.source.beginpage1
dc.source.conferenceEuropean Conference on Optical Communications (ECOC)
dc.source.conferencedate2025-09-25
dc.source.conferencelocationCopenhagen
dc.source.endpage2
dc.source.journal2025 EUROPEAN CONFERENCE ON OPTICAL COMMUNICATIONS, ECOC
dc.source.numberofpages2
dc.title

Heterogeneous integration for silicon photonics based on micro-transfer printing

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2025-12-08
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-04-07
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